Next-Gen Trends in Substrate Tech The shift toward System-in-Package (SiP) architectures places MIS at the center of chip innovation. Future MIS developments include embedding active and passive components directly inside the substrate layers. Eco-friendly, halogen-free molding resins are being introduced to meet strict green regulations. Artificial intelligence is also being integrated into inspection lines to guarantee near-zero defect rates. Reference - https://www.wiseguyreports.com/reports/molded-interconnect-substrate-mis-market